2

© 2007 Semtech Corp.

www.semtech.com

SC411

POWER MANAGEMENT

Exceeding the specifications below may result in permanent damage to the device or device malfunction. Operation outside of the parameters

specified in the Electrical Characteristics section is not implied. Exposure to Absolute Maximum rated conditions for extended periods of time

may affect device reliability.

Test Conditions: V

Parameter

Conditions

25°C

-40°C to 125°C

Units

Min

Typ

Max

Min

Max

Input Supplies

VCCA

5.0

4.5

5.5

V

VDDP

5.0

4.5

5.5

V

VBAT Voltage

Off-time > 800ns

1.8

25

V

VDDP Operating Current

FB > regulation point,

I

70

150

μA

VCCA Operating Current

FB > regulation point,

I

700

1100

μA

Notes:

1) This device is ESD sensitive. Use of standard ESD handling precautions is required.

2) Calculated from package in still air, mounted to 3” to 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51

standards.

Parameter

Symbol

Maximum

Units

TON to VSSA

-0.3 to +25.0

V

DH, BST to PGND

-0.3 to +30.0

V

LX to PGND

-2.0 to +25.0

V

PGND to VSSA

-0.3 to +0.3

V

BST to LX

-0.3 to +6.0

V

DL, ILIM, VDDP to PGND

-

0.3 to +6.0

V

EN/PSV, FB, PGD, VCCA, VOUT to VSSA

-0.3 to +6.0

V

VCCA to EN/PSV, FB, PGD, VOUT

-0.3 to +6.0

V

Thermal Resistance Junction to Ambient

(2)

(2)

θ

JA

31

°C/W

Operating Junction Temperature Range

T

J

-40 to +125

°C

Storage Temperature Range

T

STG

-65 to +150

°C

IR Reflow (Soldering) 10s to 30s

T

PKG

260

°C

Electrical Characteristics