STVM100

Maximum rating

13/27

4

Maximum rating

Stressing the device above the ratings listed in the “Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 4.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

–55 to 150

°C

(1)

1.

Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C

for between 90 to 150 seconds).

Lead solder temperature for 10 seconds

260

°C

Maximum junction temperature (plastic package)

150

°C

Output voltage (OUT pin to GND)

–0.3 to 20

V

+5.5

V

–0.3 to 20

V

Output voltage (SET pin to GND)

–0.3 to 5.5

V

Power dissipation

TDFN8

2.66

W

TSSOP8

0.53

W