Package thermal characteristics

STA333ML

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Package thermal characteristics

A thermal resistance of 25 °C per Watt can be achieved using a ground copper area of

3 x 3 cm, and using 16 vias, on the PCB (see Figure 7). The amount of power dissipated

within the device depends primarily on the supply voltage, load impedance and output

modulation level.

The max estimated dissipated power for the STA333ML is 3 W. This gives, with the

suggested board copper area, a maximum

∆Tj of 75 °C. This gives a safety margin before

a 50 °C is the maximum ambient temperature.

Figure 7.

Thermal characteristic