Silicon Planar Zener diode in bare die form – 2% tolerance

Rev 1.0

04/02/25

5W Zener Diode - 1N5338C to 1N5379C

Features:

Die Dimensions in µm (mils)

1580 (62.20)

1374 (54)



High Power Rating



Sharp Reverse Characteristics



Low Reverse Current Levels



High Reliability tested grades.

CHIP BACKSIDE IS CATHODE

ANODE

Ordering Information

The following part suffixes apply:



No suffix - Commercial grade die



“H”– Hi-rel grade die + MIL-PRF-38534 Class H LAT



“K” – Hi-rel grade die + MIL-PRF-38534 Class K LAT.

LAT = Lot acceptance Test.

For information on Hi-Rel LAT flows please see below.

www.siliconsupplies.com\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Die Size (Unsawn)

1580 x 1580

62.20 x 62.20

µm

mils

Anode Pad Size

1372 x 1372

54 x 54

µm

mils

Die Thickness

250 (±20)

9.84 (±0.79)

µm

mils

Top Metal Composition

AlSi 3µm

Back Metal Composition

NiTi-Ag 0.2-0.8µm



Default – Die in Waffle Pack (100 per tray capacity)



Sawn Wafer on Tape – By specific request



Unsawn Wafer – By specific request



With additional electrical selection – By specific request

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