The Embedded I/O Company

Technical Information

 Interface according to IndustryPack specification

 Identification-PROM supports auto-configuration

 Single Size IndustryPack / Type II

 256 kbytes of Dual-Port SRAM, organized as 128K x

16

 256 kbytes of Dual-Port Flash memory, organized as

128K x 16

 2 Mbytes of Dual-Port DRAM, organized as 256K x 32

for program and data

 MC68360 Quad Integrated Communication Processor

(25 MHz)

 Interface: TTL level interface for all 4 SCC’s

 Operating temperature: -40°C to +85°

Order Information

RoHS Compliant

TIP360-10R

Multiprotocol Communication IP, MC68360/25MHz, 2 MB DPR, 256kB SRAM, 256kB Flash

For the availability of non-RoHS compliant (leaded solder) products please contact TEWS.

Documentation

TIP360-DOC

User Manual

Software

For operating systems please contact TEWS.

TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

All trademarks mentioned are property of their respective owners.

Issue 1.0.0

2014-01-14

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com