| Datenblatt-Suchmaschine für elektronische Bauteile |
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TMPE623-DOC Datenblatt(PDF) 2 Page - TEWS Technologies GmbH |
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TMPE623-DOC Datenblatt(HTML) 2 Page - TEWS Technologies GmbH |
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2 / 3 page ![]() TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice. All trademarks mentioned are property of their respective owners. Issue 1.0.0 2018-04-24 TEWS TECHNOLOGIES GmbH Am Bahnhof 7 25469 Halstenbek, Germany Phone: +49 (0) 4101 4058 0 Fax: +49 (0) 4101 4058 19 e-mail: info@tews.com www.tews.com The Embedded I/O Company TMPE623 with TA308 & Platform Cable USB TA309 Technical Information Form Factor: Full-Mini Card Board size: 50.95 mm x 30 mm PCI Express 1.1 compliant interface Xilinx XC7A50T-2 Artix-7 User programmable FPGA PCIe endpoint in FPGA 128 Mbit SPI-EEPROM for FPGA configuration and User Data Digital I/O 26 ESD-protected 5 V-tolerant TTL lines with programmable pull resistor (-10R) 13 differential EIA-422 / EIA-485 lines (-11R) 13 differential M-LVDS lines (-12R) Direction individually programmable I/O access 30 pin Pico-Clasp latching connector Operating temperature -40°C to +85°C MTBF (MIL-HDBK217F/FN2 GB 20°C) TMPE623: 1.200.000 h TMPE623 Block Diagram |
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