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74ALVC374 Datenblatt(PDF) 13 Page - NXP Semiconductors |
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74ALVC374 Datenblatt(HTML) 13 Page - NXP Semiconductors |
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13 / 17 page ![]() 74ALVC374_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 17 October 2007 13 of 17 NXP Semiconductors 74ALVC374 Octal D-type flip-flop; positive-edge trigger; 3-state Fig 12. Package outline SOT360-1 (TSSOP20) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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