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CLS02 Datenblatt(PDF) 2 Page - Toshiba Semiconductor |
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CLS02 Datenblatt(HTML) 2 Page - Toshiba Semiconductor |
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2 / 5 page ![]() CLS02 2007-11-06 2 Marking Abbreviation Code Part No. S02 CLS02 Standard Soldering Pad Handling Precautions 1) Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility that SBD will cause thermal runaway when used under high-temperature or high-voltage conditions. Be sure to take forward and reverse loss into consideration during design. 2) The absolute maximum ratings, are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for when designing a circuit incorporating this device. VRRM: Use this rating with reference to (1) above. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device for operation at low temperatures. IF (AV): We recommend that the worst case current be no greater than 80% of the maximum rating of IF (AV) and that Tj be below 100°C. When using this device, take the margin into consideration by using an allowable Tamax-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies only to abnormal operation, which seldom occurs during the lifespan of the device. Tj: Derate this rating when using the device in order to ensure high reliability. We recommend that the device be used at a Tj of below 100°C. 3) Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When using the device, design the circuit board and soldering land size to match the appropriate thermal resistance value. 4) Refer to the databook on Rectifiers for further information. Unit: mm 2.6 1.8 4.8 5.9 |
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