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STA538 Datenblatt(PDF) 54 Page - STMicroelectronics |
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STA538 Datenblatt(HTML) 54 Page - STMicroelectronics |
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54 / 59 page ![]() Package information STA538 54/59 11 Package information This section includes packaging information for the following packages: ● TFBGA48 ● VFQFPN52 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These package have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 11.1 Package TFBGA48 Figure 17. Mechanical data (TFBGA48) |
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