| Datenblatt-Suchmaschine für elektronische Bauteile |
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STV7622 Datenblatt(PDF) 30 Page - STMicroelectronics |
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STV7622 Datenblatt(HTML) 30 Page - STMicroelectronics |
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30 / 32 page ![]() Pad dimensions and positions (in µm) STV7622 30/32 LEFT SIDE from bottom to top VCC1 -7474.9 -555.2 65.6 43.5 VDD1 -7474.9 -189.2 65.6 43.5 VSSSUB1 -7474.9 -114.3 65.6 43.5 VSSLOG1 -7474.9 -39.4 65.6 43.5 DUMMY -7474.9 35.5 65.6 43.5 VPP3 -7474.9 110.3 65.6 43.5 VPP2 -7474.9 185.2 65.6 43.5 VPP1 -7474.9 260.1 65.6 43.5 VSSP3 -7474.9 485.5 65.6 43.5 VSSP2 -7474.9 560.3 65.6 43.5 VSSP1 -7462.9 635.2 65.6 43.5 Table 13. Pad placement and bump pad dimensions (in microns) (continued) Lead pad name Pad placements Bump dimensions X Y X Y |
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