BAS16H

Taiwan Semiconductor

2

Version: A2412

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-ambient thermal resistance(1)

RӨJA

357

°C/W

Thermal Performance Note:

1. Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

MIN

TYP

MAX

UNIT

Forward voltage(1)

IF = 1mA

VF

-

-

0.715

V

IF = 10mA

-

-

0.855

IF = 50mA

-

-

1.000

IF = 150mA

-

-

1.250

Reverse breakdown voltage

IR

= 100μA

VBR

100

-

-

V

Reverse current(2)

VR = 75V

IR

-

-

0.5

μA

VR = 75V, TJ = 150°C

-

-

50

μA

Junction capacitance

f = 1MHz, VR = 0V

CJ

-

-

2

pF

Reverse recovery time

IF = IR = 10mA,

IRR = 1mA, RL =

100Ω

trr

-

-

4

ns

Notes:

1.

Pulse test with PW=0.3 ms

2.

Pulse test with PW=30 ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

BAS16H RFG

SOT-23

3,000 / 7” Tape & Reel