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SHT41A-AWSB-R3 Datenblatt(PDF) 14 Page - Sensirion AG Switzerland |
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SHT41A-AWSB-R3 Datenblatt(HTML) 14 Page - Sensirion AG Switzerland |
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14 / 22 page ![]() www.sensirion.com / D1 Version 1.0 – May 2025 14 / 22 5.9 Important notes for operating the heater: 1. The heater is designed for a maximum duty cycle of 10%, meaning the total heater-on-time should not be longer than 10% of the sensor’s lifetime. 2. During operation of the heater, sensor specifications are not valid. 3. The temperature sensor can additionally be affected by the thermally induced mechanical stress, offsetting the temperature reading from the actual temperature. 4. The sensor’s temperature (base temperature + temperature increase from heater) must not exceed Tmax = 125 °C to have proper electrical functionality of the chip. 5. In its highest power setting, the heater can draw currents up to ~50 mA. The power supply should be sized accordingly. 6. If higher heating temperatures are desired, consecutive heating commands can be sent to the sensor. To keep times between consecutive heating pulses minimal, polling of the sensor is advised. The heater shall only be operated in ambient temperatures below 65 °C or else it could drive the sensor outside of its maximal operating temperature. 5.10 Reset A reset of the sensor can be achieved in three ways: • I2C Soft reset: send the reset command described in Table 9. • I2C general call: all devices on I2C bus are reset by sending command 0x06 to the I2C address 0x00. • Power down (incl. pulling SCL and SDA low) 6 Physical Specification 6.1 Package Description SHT41A-AWSB is provided in an open-cavity dual flat no lead (DFN) package. The humidity sensor opening is centered on the top side of the package. The sensor chip is made of silicon, hosted on a copper lead frame and overmolded by an epoxy-based mold compound. Exposed bottom side of the leadframe with the metallic contacts is Ni/Pd/Au coated, side walls are bare copper. Moisture sensitivity level (MSL) of 1 according to IPC/JEDEC J-STD-020 is achieved. It is recommended to process the sensors within one year of the date of delivery. |
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