LM237, LM337

SLVS047L – NOVEMBER 1981 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating temperature ranges (unless otherwise noted)

(1)

MIN

MAX

UNIT

VI – VO

Input-to-output differential voltage

–40

V

TJ

Operating virtual junction temperature

150

°C

Lead temperature

1.6 mm (1/16 in) from case for 10 s

260

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

1500

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

1500

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3

Recommended Operating Conditions

MIN

MAX

UNIT

VI-VO

Input-to-output differential voltage

-2.5

-37

|VI – VO| ≤ 40 V, P ≤ 15 W

10

1500

IO

Output current

mA

|VI – VO| ≤ 10 V, P ≤ 15 W

6

1500

LM237

–25

150

TJ

Operating virtual junction temperature

°C

LM337

0

125

7.4 Thermal Information

LM237

LMx37

LM337

THERMAL METRIC(1)

KC

KCS

KTE

KTP

KTT

KVU

UNIT

4 PINS

4 PINS

4 PINS

4 PINS

4 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

24.8

24.8

23

28

25.3

30.3

°C/W

RθJC(top

Junction-to-case (top) thermal resistance

3

3

3

19

30.3

N/A

)

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

4

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