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LM48823TLEVAL Datenblatt(PDF) 1 Page - Texas Instruments

Teilenummer LM48823TLEVAL
Bauteilbeschribung  LM48823 Mono, Bridge-Tied Load, Ceramic Speaker Driver with I2C Volume Control and Reset
PDF  21 Pages
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Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM48823TLEVAL Datenblatt(HTML) 1 Page - Texas Instruments

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LM48823, LM48823TLEVAL
www.ti.com
SNAS464E – JUNE 2008 – REVISED OCTOBER 2010
LM48823
Mono, Bridge-Tied Load, Ceramic Speaker Driver with I2C Volume Control and Reset
Check for Samples: LM48823, LM48823TLEVAL
1
FEATURES
KEY SPECIFICATIONS
2
•
Integrated Charge Pump
•
Output Voltage at VDD = 4.2V, RL = 2.2µF + 15Ω
THD+N
≤ 1%: 5.4VRMS (typ)
•
Bridge-Tied Load Output
•
Quiescent Power Supply Current at 4.2V:
•
High PSRR
3.3mA (typ)
•
I2C Volume and Mode Control
•
PSRR at 217Hz: 93dB (typ)
•
Reset Input
•
Shutdown Current: 0.01
μA (typ)
•
Advanced Click-and-Pop Suppression
•
Low Supply Current
DESCRIPTION
•
Minimum External Components
The LM48823 is a single supply, mono, ceramic
•
Micro-Power Shutdown
speaker driver with an integrated charge-pump,
designed for portable devices, such as cell phones,
•
Available in Space-Saving 16-Bump DSBGA
where board space is at a premium. The LM48823
Package
charge pump allows the device to deliver 5.4VRMS
from a single 4.2V supply.
APPLICATIONS
The LM48823 features high power supply rejection
•
Cell Phones
ratio (PSRR), 93dB at 217Hz, allowing the device to
•
Smart Phones
operate in noisy environments without additional
power supply conditioning. Flexible power supply
•
Portable Media Devices
requirements allow operation from 2.0V to 4.5V. The
•
Notebook PCs
LM48823 features an active low reset input that
reverts the device to its default state. Additionally, the
LM48823 features a 32-step I2C volume control. The
low power Shutdown mode reduces supply current
consumption to 0.01µA.
The LM48823’s superior click and pop suppression
eliminates audible transients on power-up/down and
during shutdown. The LM48823 is available in an
ultra-small 16-bump DSBGA package (2mmx2mm).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.


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