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LM61

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SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016

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6.6 Typical Characteristics

The LM61 in the SOT-23 package mounted to a printed-circuit board as shown in Figure 18 was used to generate the

following thermal curves.

Figure 1. Junction-to-Ambient Thermal Resistance

Figure 2. Thermal Time Constant

Figure 3. Thermal Response in Still Air with Heat Sink

Figure 4. Thermal Response in Stirred Oil Bath

with Heat Sink

Figure 5. Thermal Response in Still Air without Heat Sink

Figure 6. Quiescent Current vs Temperature