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PACKAGE OUTLINE

C

SEE TERMINAL

DETAIL

40X

0.3

0.2

2.9 0.1

40X

0.5

0.3

1 MAX

0.05

0.00

36X 0.5

2X

4.5

2X 4.5

(0.1) TYP

A

6.1

5.9

B

6.1

5.9

0.3

0.2

0.5

0.3

VQFN - 1 mm max height

RHA0040D

PLASTIC QUAD FLATPACK - NO LEAD

4225822/A 03/2020

PIN 1 INDEX AREA

0.08 C

SEATING PLANE

1

10

21

30

11

20

40

31

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

EXPOSED

THERMAL PAD

41

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 2.200

DETAIL

OPTIONAL TERMINAL

TYPICAL