HIP2103-4DEMO2Z datasheet(30/31 Pages) RENESAS

30 / 31 page

HIP2103, HIP2104

10. Package Outline Drawings

FN8276 Rev.2.0

Page 30 of 30

Feb 25, 2021

M8.15

8 Lead Narrow Body Small Outline Plastic Package

Rev 4, 1/12

DETAIL "A"

TOP VIEW

INDEX

AREA

-C-

SEATING PLANE

x 45°

NOTES:

17. Dimensioning and tolerancing per ANSI Y14.5M-1994.

18. Package length does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

19. Package width does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

20. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

21. Terminal numbers are shown for reference only.

22. The lead width as measured 0.36mm (0.014 inch) or greater above the

seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).

23. Controlling dimension: MILLIMETER. Converted inch dimensions are not

necessarily exact.

24. This outline conforms to JEDEC publication MS-012-AA ISSUE C.

SIDE VIEW “A

SIDE VIEW “B”

1.27 (0.050)

6.20 (0.244)

5.80 (0.228)

4.00 (0.157)

3.80 (0.150)

0.50 (0.20)

0.25 (0.01)

5.00 (0.197)

4.80 (0.189)

1.75 (0.069)

1.35 (0.053)

0.25(0.010)

0.10(0.004)

0.51(0.020)

0.33(0.013)

8°

0°

0.25 (0.010)

0.19 (0.008)

1.27 (0.050)

0.40 (0.016)

1.27 (0.050)

5.20(0.205)

TYPICAL RECOMMENDED LAND PATTERN

2.20 (0.087)

0.60 (0.023)

For the most recent package outline drawing, see M8.15.

HIP2103-4DEMO2Z Datenblatt(PDF) 30 Page - Renesas Technology Corp

HIP2103-4DEMO2Z Datenblatt(HTML) 30 Page - Renesas Technology Corp

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

Datenblatt Download

Link URL