1

2

3

4

8

7

6

5

V

DD

DCLOCK

D

OUT

CS/SHDN

REF

+IN

-IN

GND

ADS8317

REF

+IN

-IN

GND

V

DD

DCLOCK

D

OUT

CS/SHDN

1

2

3

4

8

7

6

5

ADS8317

(ThermalPad)

R

50W

ON

C

(SAMPLE)

24pF

V

DD

I/O

GND

V

DD

ANALOGIN

GND

DiodeTurn-OnVoltage:0.35V

EquivalentAnalogInputCircuit

V

DD

REF

GND

EquivalentReferenceInputCircuit

EquivalentDigitalInput/OutputCircuit

24pF

R

50W

ON

ADS8317

www.ti.com .................................................................................................................................................... SBAS356D – JUNE 2007 – REVISED OCTOBER 2009

PIN CONFIGURATION

DGK PACKAGE

MSOP-8

(TOP VIEW)

DRB PACKAGE

SON-8

(TOP VIEW)

(1)

The DRB package thermal pad must be soldered to the printed circuit board for proper thermal and mechanical

performance.

TERMINAL FUNCTIONS

TERMINAL

NAME

NO.

I/O

DESCRIPTION

REF

1

Analog input

Reference input

+IN

2

Analog input

Noninverting analog input

–IN

3

Analog input

Inverting analog input

GND

4

Power-supply connection

Ground

CS/SHDN

5

Digital input

Chip select when low; Shutdown mode when high.

DOUT

6

Digital output

Serial output data word

DCLOCK

7

Digital input

Data clock synchronizes the serial data transfer and determines conversion speed.

VDD

8

Power-supply connection

Power supply

Equivalent Input Circuits (VDD = 5.0V)

Copyright © 2007–2009, Texas Instruments Incorporated

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