NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4219112/A 07/2018

www.ti.com

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK- NO LEAD

RTA0040B

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

(0.2) TYP

0.8 MAX

0.05

0.00

PIN 1 INDEX AREA

6.1

5.9

6.1

5.9

4.15±0.1

2X 4.5

2X

4.5

36X 0.5

40X

0.28

0.16

40X

0.5

0.3

SEATING PLANE

C

1

PIN1 IDENTIFICATION

(OPTIONAL)

10

11

20

21

30

31

40

41