5

INA139, INA169

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

INA1x9

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

168.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.8

°C/W

RθJB

Junction-to-board thermal resistance

28.1

°C/W

ψJT

Junction-to-top characterization parameter

2.5

°C/W

ψJB

Junction-to-board characterization parameter

27.6

°C/W