5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX UNIT

VCCA to

VGNDA

Supply voltage A to Ground voltage A

–0.5

6.5

V

VCCB to

VGNDB

Supply voltage B to Ground voltage B

–0.5

6.5

V

VGNDA to

VGNDB

Voltage between GNDA and GNDB

Voltage between

GNDA and GNDB

-15

15

V

VI

Input Voltage(2)

I/O Ports (A Port) to

VGNDA

–0.5

6.5

V

I/O Ports (B Port) to

VGNDB

–0.5

6.5

VO

Voltage applied to any output in the high-impedance or power-off

state(2)

A Port to VGNDA

–0.5

6.5

V

B Port to VGNDB

–0.5

6.5

VO

Voltage applied to any output in the high or low state(2) (3)

A Port to VGNDA

–0.5 VCCA + 0.5

V

B Port to VGNDB

–0.5 VCCB + 0.5

IIK

Input clamp current

VI < 0

–20

mA

IOK

Output clamp current

VO < 0

–20

mA

IO

Continuous output current

–25

25

mA

Continuous current through VCC or GND

–100

100

mA

Tj

Junction Temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Section 5.1 may cause permanent damage to the device. These are stress ratings only, which

do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3. Exposure

beyond the limits listed in Section 5.3 may affect device reliability.

(2)

The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

The output positive-voltage rating may be exceeded up to 6.5V maximum if the output current rating is observed.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

±500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

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SCES997 – JUNE 2025

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