AMC1200, AMC1200B

SBAS542D – APRIL 2011 – REVISED JULY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

Over the operating ambient temperature range, unless otherwise noted.

(1)

MIN

MAX

UNIT

Supply voltage, VDD1 to GND1 or VDD2 to GND2

–0.5

6

V

Analog input voltage at VINP, VINN

GND1 – 0.5

VDD1 + 0.5

V

Input current to any pin except supply pins

–10

10

mA

Maximum junction temperature, TJ Max

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute

maximum rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM) JEDEC standard 22, test method A114-

±2500

C.01(1)

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Operating ambient temperature range

–40

105

°C

VDD1

High-side power supply

4.5

5

5.5

V

VDD2

Low-side power supply

2.7

5

5.5

V

6.4 Thermal Information

AMC1200, AMC1200B

THERMAL METRIC(1)

DUB (SOP)

DWV (SOIC)

UNIT

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

75.1

102.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.6

49.8

°C/W

RθJB

Junction-to-board thermal resistance

39.8

56.6

°C/W

ψJT

Junction-to-top characterization parameter

27.2

16

°C/W

ψJB

Junction-to-board characterization parameter

39.4

55.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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