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VN750 Datenblatt(PDF) 9 Page - STMicroelectronics

Teilenummer VN750
Bauteilbeschribung  High-side driver
PDF  46 Pages
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Hersteller  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
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VN750 Datenblatt(HTML) 9 Page - STMicroelectronics

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VN750
Electrical specifications
Doc ID 6942 Rev. 4
9/46
2.2
Thermal data
Symbol
Parameter
Value
Unit
SO-8
PENTAWATT
P2PAK
PPAK
EMAX
Maximum switching energy
(L = 1.8 mH; RL =0 Ω;
Vbat = 13.5 V; Tjstart =150°C;
IL =9 A)
100
mJ
EMAX
Maximum switching energy
(L = 2.46 mH; RL =0 Ω;
Vbat = 13.5 V; Tjstart =150°C;
IL =9 A)
138
138
mJ
Ptot
Power dissipation TC = 25°C
4.2
60
60
60
W
Tj
Junction operating temperature
Internally limited
°C
Tc
Case operating temperature
-40 to 150
°C
Tstg
Storage temperature
-55 to 150
°C
Table 3.
Absolute maximum ratings (continued)
Table 4.
Thermal data
Symbol
Parameter
Max. value
Unit
S0-8
PENTAWATT P2PAK
PPAK
Rthj-case Thermal resistance junction-case
-
2.1
2.1
2.1
°C/W
Rthj-lead Thermal resistance junction-lead
30
-
-
-
°C/W
Rthj-amb Thermal resistance junction-ambient
93(1)
1.
When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected
to all VCC pins. Horizontal mounting and no artificial air flow.
62.1
52.1(2)
2.
When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick). Horizontal
mounting and no artificial air flow.
77.1(2)
°C/W
82(3)
3.
When mounted on a standard single-sided FR-4 board with 2 cm2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow.
62.1
37(4)
4.
When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick). Horizontal
mounting and no artificial air flow.
44(4)
°C/W
Obsolete
Product(s)
- Obsolete
Product(s)



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