7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VS

Supply voltage

Dual supply, VS = (V+) – (V–)

±18

V

Single supply, VS = (V+) – 0 V

36

Analog input voltage

±40

V

Output short-circuit(2)

Continuous

TA

Operating temperature

–40

125

°C

Junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Tstg

Storage temperature

–55

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to VS / 2.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±50

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VS

Supply voltage

Single-supply

4.5

30

36

V

Dual-supply

±2.25

±15

±18

Input common-mode voltage range for VO = 0 V

(V–) + 2

(V+) – 2

V

TA

Specified temperature

–40

85

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA12x

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

110

46.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57

34.1

°C/W

RθJB

Junction-to-board thermal resistance

54

23.4

°C/W

ψJT

Junction-to-top characterization parameter

11

11.3

°C/W

ψJB

Junction-to-board characterization parameter

53

23.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

INA128, INA129

SBOS051F – OCTOBER 1995 – REVISED MAY 2022

Copyright © 2022 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: INA128 INA129