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INA190

SBOS863D – MARCH 2018 – REVISED NOVEMBER 2019

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Copyright © 2018–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

(3)

Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VS

Supply voltage

6

V

VIN+, VIN– Analog inputs

Differential (VIN+) – (VIN–)

(2)

–42

42

V

VIN+, VIN–, with respect to GND

(3)

GND – 0.3

42

VENABLE

ENABLE

GND – 0.3

6

V

REF, OUT(3)

GND – 0.3

(VS) + 0.3

V

Input current into any pin(3)

5

mA

TA

Operating temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range

GND – 0.2

40

V

VIN+, VIN–

Input pin voltage range

GND – 0.2

40

V

VS

Operating supply voltage

1.7

5.5

V

VREF

Reference pin voltage range

GND

VS

V

TA

Operating free-air temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

INA190

UNIT

DCK (SC70)

DDF (SOT23)

RSW (UQFN)

6 PINS

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal resistance

137.2

170.7

163.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

38.4

132.7

78.7

°C/W

RθJB

Junction-to-board thermal resistance

57.1

65.3

93.3

°C/W

ΨJT

Junction-to-top characterization parameter

5.1

45.7

4.1

°C/W

ΨJB

Junction-to-board characterization parameter

56.6

65.2

92.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W