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LM340, LM340A, LM7805, LM7812, LM7815

SNOSBT0L – FEBRUARY 2000 – REVISED SEPTEMBER 2016

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Product Folder Links: LM340 LM340A LM7805 LM7812 LM7815

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Copyright © 2000–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation

(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX −

TA)/θJA. If this dissipation is exceeded, the die temperature rises above TJMAX and the electrical specifications do not apply. If the die

temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal

resistance (θJA) is 39°C/W. When using a heat sink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3

package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W.

If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on

heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area

thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is

37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

DC input voltage

35

V

Internal power dissipation(3)

Internally Limited

Maximum junction temperature

150

°C

Lead temperature (soldering, 10 sec.)

TO-3 package (NDS)

300

°C

Lead temperature 1,6 mm (1/16 in) from case for 10 s

230

°C

Storage temperature

−65

150

°C

(1)

ESD rating is based on the human-body model, 100 pF discharged through 1.5 kΩ.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM)(1)

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature (TA)

LM340A, LM340

0

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM340, LM7805 Family

UNIT

NDE

(TO-220)

KTT

(DDPAK/TO-263)

DCY

(SOT-223)

NDS

(TO-3)

3 PINS

3 PINS

4 PINS

2 PINS

RθJA

Junction-to-ambient thermal resistance

23.9

44.8

62.1

39

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

16.7

45.6

44

2

°C/W

RθJB

Junction-to-board thermal resistance

5.3

24.4

10.7

—

°C/W

ψJT

Junction-to-top characterization parameter

3.2

11.2

2.7

—

°C/W

ψJB

Junction-to-board characterization parameter

5.3

23.4

10.6

—

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

1.7

1.5

—

—

°C/W