| Datenblatt-Suchmaschine für elektronische Bauteile |
|
STPA002 Datenblatt(PDF) 20 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STPA002 Datenblatt(HTML) 20 Page - STMicroelectronics |
|
20 / 24 page ![]() General information STPA002 20/24 DocID024368 Rev 3 5.5 Heat sink definition Assuming we have a dissipated power of 26 W (e.g. in the worst case situation of frequent clipping occurrence, with music signal), considering Tj max is 150 °C and assuming ambient temperature is 70 °C, the available temperature gap for a correct dissipation is 80 °C. This means the thermal resistance of the system Rth has to be 80 °C/26 W = 3 °C/W. The junction to case thermal resistance is 1 °C/W. So the heat sink thermal resistance should be approximately 2 °C/W. This would avoid any thermal shutdown occurrence even after long-term and full-volume operation. |
|
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |