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LOG114 Datenblatt(PDF) 42 Page - Texas Instruments |
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LOG114 Datenblatt(HTML) 42 Page - Texas Instruments |
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42 / 43 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 16X (0.75) 16X (0.305) 12X (0.65) (3.65) (3.65) (0.58) TYP (0.58) TYP 4X (0.96) 4X (0.96) (R0.05) TYP VQFN - 1 mm max height RGV0016A PLASTIC QUAD FLATPACK - NO LEAD 4219037/A 06/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X EXPOSED PAD 17 79% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SYMM SYMM 1 4 5 8 9 12 13 16 17 |
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