Figure 7. Reverse leakage current versus reverse voltage

applied (typical values)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

0

5

10 15 20 25 30 35 40 45 50 55 60

360°

α

I

R(mA)

T

j = 150 °C

V

R(V)

T

j = 125 °C

T

j = 100 °C

T

j = 75 °C

T

j = 50 °C

T

j = 25 °C

Figure 8. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

10

100

C(pF)

V

R

(V)

360°

α

F = 1 MHz

VOSC = 30 mVRMS

T

j

= 25 °C

Figure 9. Forward voltage drop versus forward current

(low level)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

360°

α

IF(A)

Tj = 125 °C

(maximum values)

V

F

(V)

Tj = 25 °C

(maximum values)

Tj = 125 °C

(typical values)

Figure 10. Forward voltage drop versus forward current

(high level)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60

VF(V)

0

5

10

15

20

25

30

35

40

45

50

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IF(A)

Tj = 125 °C

(maximum values)

VF(V)

Tj = 125 °C

(typical values)

Tj = 25 °C

(maximum values)

Figure 11. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (SMB flat Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SMB Flat Notch

SCu(cm²)

Epoxy printed board FR4, copper thickness: 35 μm

STPS5L60

Characteristics (curves)

DS2741 - Rev 5

page 5/16