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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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TLV9152SIRUGR Datenblatt(PDF) 10 Page - Texas Instruments |
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TLV9152SIRUGR Datenblatt(HTML) 10 Page - Texas Instruments |
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10 / 85 page  6.5 Thermal Information for Dual Channel THERMAL METRIC (1) TLV9152, TLV9152S UNIT D (SOIC) DDF (SOT-23) DGK (VSSOP) DSG (WSON) PW (TSSOP) RUG (X2QFN) 8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 138.7 143.5 176.5 77.6 185.1 142.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.7 79.9 68.1 93.7 74.0 53.5 °C/W RθJB Junction-to-board thermal resistance 82.2 61.6 98.2 43.9 115.7 68.5 °C/W ψJT Junction-to-top characterization parameter 27.8 5.7 12.0 4.4 12.3 1.0 °C/W ψJB Junction-to-board characterization parameter 81.4 61.3 96.7 43.9 114.0 68.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 19.0 N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.6 Thermal Information for Quad Channel THERMAL METRIC (1) TLV9154 UNIT D (SOIC) DYY (SOT-23) PW (TSSOP) RUC (X2QFN) 14 PINS 14 PINS 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 101.4 110.6 131.4 125.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 57.6 53.7 51.8 39.8 °C/W RθJB Junction-to-board thermal resistance 57.3 35.3 75.8 68.0 °C/W ψJT Junction-to-top characterization parameter 18.5 2.2 7.9 0.8 °C/W ψJB Junction-to-board characterization parameter 56.9 35.0 74.8 67.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. TLV9151, TLV9152, TLV9154 SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022 www.ti.com 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TLV9151 TLV9152 TLV9154 |
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