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TSA1203IF Datenblatt(PDF) 27 Page - STMicroelectronics |
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TSA1203IF Datenblatt(HTML) 27 Page - STMicroelectronics |
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27 / 30 page ![]() TSA1203 Package mechanical data 27/30 11 Package mechanical data In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 11.1 TQFP48 package DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 1.6 0.063 A1 0.05 0.15 0.002 0.006 A2 1.35 1.40 1.45 0.053 0.055 0.057 B 0.17 0.22 0.27 0.007 0.009 0.011 C 0.09 0.20 0.0035 0.0079 D 9.00 0.354 D1 7.00 0.276 D3 5.50 0.216 e 0.50 0.020 E 9.00 0.354 E1 7.00 0.276 E3 5.50 0.216 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.00 0.039 K 0˚3.5˚7˚ 0˚3.5˚7˚ TQFP48 MECHANICAL DATA 0110596/C Obsolete Product(s) - Obsolete Product(s) |
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