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TMUX1102DBVR Datenblatt(PDF) 4 Page - Texas Instruments

Teilenummer TMUX1102DBVR
Bauteilbeschribung  TMUX110x 5V, Low-Leakage-Current, 1:1 (SPST) Precision Switch
PDF  38 Pages
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Hersteller  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TMUX1102DBVR Datenblatt(HTML) 4 Page - Texas Instruments

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN
MAX
UNIT
VDD
Supply voltage
–0.5
6
V
VSEL
Logic control input pin voltage (SELx)
–0.5
6
V
ISEL
Logic control input pin current (SELx)
–30
30
mA
VS or VD
Source or drain voltage (Sx, Dx)
–0.5
VDD+0.5
V
IS or ID (CONT)
Source or drain continuous current (Sx, Dx)
IDC ± 10 %(4)
IDC ± 10 %(4)
mA
IS or ID (PEAK)
Source and drain peak current: (1 ms period max, 10% duty cycle
maximum) (Sx, Dx)
Ipeak ± 10 %(4)
Ipeak ± 10 %(4)
mA
Tstg
Storage temperature
–65
150
°C
Ptot
Total power dissipation(5) (6)
250
mW
TJ
Junction temperature
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3)
All voltages are with respect to ground, unless otherwise specified.
(4)
Refer to Recommended Operating Conditions for IDC and IPeak ratings.
(5)
For DBV(SOT-23) package: Ptot derates linearly above TA = 93°C by 4.45mW/°C.
(6)
For DCK(SC70) package: Ptot derates linearly above TA = 62°C by 2.87mW/°C.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101
or ANSI/ESDA/JEDEC JS-002, all pins(2)
±750
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
VDD
Supply voltage
1.08
5.5
V
VS or VD
Signal path input/output voltage (source or drain pin) (Sx, Dx)
0
VDD
V
VSEL
Logic control input pin voltage (SELx)
0
5.5
V
TA
Ambient temperature
–40
125
°C
IDC
Continuous current through switch
Tj = 25°C
150
mA
Tj = 85°C
120
mA
Tj = 125°C
60
mA
Tj = 130°C
50
mA
Ipeak
Peak current through switch(1 ms period max, 10%
duty cycle maximum)
Tj = 25°C
300
mA
Tj = 85°C
300
mA
Tj = 125°C
180
mA
Tj = 130°C
160
mA
TMUX1101, TMUX1102
SCDS410D – MARCH 2019 – REVISED FEBRUARY 2024
www.ti.com
4
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Copyright © 2024 Texas Instruments Incorporated
Product Folder Links: TMUX1101 TMUX1102



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