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PACKAGE OUTLINE

C

0.35 MAX

0.135

0.075

1.2

TYP

0.4

TYP

0.4

TYP

12X

0.20

0.16

B

1.20

1.14

A

1.558

1.498

4229771/A 06/2023

DSBGA - 0.35 mm max height

YBJ0012-C01

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

BALL A1

CORNER

SEATING PLANE

BALL TYP

0.05 C

A

1

2

0.015

C A B

SYMM

SYMM

B

C

D

3

SCALE 10.000

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INA191, INA2191

SLYS020C – FEBRUARY 2019 – REVISED AUGUST 2021

Copyright © 2023 Texas Instruments Incorporated

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