6.4 Thermal Information (D Package)

THERMAL METRIC(1)

D (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance

116.5

°C/W

RθJC(top) Junction-to-case (top) thermal resistance

52.8

°C/W

RθJB

Junction-to-board thermal resistance

58.9

°C/W

ΨJT

Junction-to-top characterization parameter

19.4

°C/W

ΨJB

Junction-to-board characterization parameter

58.0

°C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

AMC0300R, AMC0200R

SBASAR9 – DECEMBER 2025

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