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HCTS85MS

Die Characteristics

DIE DIMENSIONS:

100 x 100 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å

GLASSIVATION:

Thickness: 13k

Å

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS85MS

B3

(1)

(A<B)IN

(2)

(A=B)IN(3)

(A>B)IN(4)

(A<B)OUT(5)

(A=B)OUT(6)

(A>B)OUT

(7)

GND

(8)

B0

(9)

A0

(10)

(11) B1

(12) A1

(13) A2

(14) B2

VCC

(16)

A3

(15)

Spec Number

518624