Data Sheet

ADRF5203

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 15

For recommended operating conditions, see Table 1.

Table 2. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

Positive

−0.3V to +13.2V

Negative

−13.2V to +0.3V

Digital Control Inputs 1

Voltage

−0.3V to +3.6V

Current

3mA

RF Input Power 2, 3 (VDD = 12V, VSS = −12V, f =

100MHz to 10GHz, TCASE = 85°C4)

Through Path

31.5dBm

Terminated Path

Average

24.5dBm

Peak5

31.5dBm

Hot Switching

24.5dBm

RF Input Power, Unbiased (VDD and VSS = 0V) 30.5dBm

Temperature

Junction, TJ

135°C

Storage Range

−65°C to +150°C

Reflow

260°C

1 Overvoltages at digital control inputs are clamped by internal diodes. Current

must be limited to the maximum rating given.

2 For power derating over frequency, see Figure 2 and Figure 3.

3 For power derating over DC voltages, see Figure 4 and Figure 5.

4 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3dB.

5 Peak is ≤100ns pulse duration and 5% duty cycle.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to case bottom (channel to package bottom)

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC1

Unit

CC-22-5

Through Path

49

°C/W

Terminated Path

72

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

round pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Maximum RF Power Derating vs. Frequency, TCASE = 85°C

Figure 3. Maximum RF Power Derating vs. Frequency over VDC, TCASE = 85°C

(Low Frequency)