VL6624 datasheet(101/106 Pages) STMICROELECTRONICS

Teilenummer	VL6624

Bauteilbeschribung	1.3 Megapixel single-chip camera module

PDF	106 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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101 / 106 page

VL6624/VS6624

Package mechanical data

101/106

15.2

LGA

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 52.

LGA package mechanical data

Data book (mm)

Symbol

Min.

Typ.

Max.

1.80

1.90

2.00

0.35

0.4

0.45

0.7

0.8

0.9

2.0

3.5

0.55

0.25

0.30

0.35

9.90

10.00

10.10

9.60

9.70

9.80

5.4

e0.8

9.90

10.00

10.10

9.60

9.70

9.80

4.5

1.0

1.1

1.2

0.3

0.4

0.5

0.8

0.9

1.0

0.8

0.9

1.0

0.8

0.3

0.4

0.5

3.95

4.05

4.15

J4.1

K0.3

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