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ZIOL2201 Datenblatt(PDF) 68 Page - Renesas Technology Corp |
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ZIOL2201 Datenblatt(HTML) 68 Page - Renesas Technology Corp |
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68 / 92 page ![]() ZIOL2xxx Datasheet © 2016 Integrated Device Technology, Inc. 68 April 26, 2016 Figure 6.1 Pin Diagram of the ZIOL2xxx 1 14 15 16 17 18 6 5 4 3 2 13 11 10 9 8 7 12 22 21 20 19 23 24 DC_RDY RST_L SW *) FB *) VDD AUX_I *) ZIOL2401 INT_L SPI_EN_L LR_OUT WURQ_L VDD COM_I *) *) Availability depends on the pin hardware configuration 6.1.3. Optimal PCB Layout In order to obtain optimal heat distribution (minimized thermal resistance between package and board) certain PCB layout rules shall be applied. Those rules are described in the application note for the used QFN package (refer to chapter 8, [4]). Crucial for optimal heat distribution is the correct number, diameter and placement of via’s underneath the exposed die paddle as described in the above mentioned application note. |
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