HT7886

Buck Converter

Copyright©2023, Heroic Technology

-4-

8/2023 – V1.2

◼ TERMINAL CONFIGURATION

8

7

6

5

1

2

3

4

FB

NC

VI N

BST

GND

EN

DIM

SW

EP

GND

Top View

◼ TERMINAL FUNCTION

Terminal

No.

Name

Description

1

FB

Feedback. FB is the input to the voltage hysteretic comparators. The average FB voltage

is maintained at 200mV by loop regulation.

反馈。FB是电压迟滞比较器的输入。通过环路调节， FB电压保持在平均200mV

2

NC

No connection. 无连接

3

VIN

Input supply. VIN supplies power to all of the internal control circuitries, both BST

regulators, and the high-side switch. A decoupling capacitor to ground must be placed

close to VIN to minimize switching spikes.

输入电源。VIN为所有内部控制电路、BST调节器和高端管供电。接地滤波电容必

须放置在VIN附近，以减少开关尖峰

4

BST

Bootstrap. BST is the positive power supply for the internal, floating, high-side MOSFET

driver. Connect a bypass capacitor between BST and SW.

BST是内部高端MOSFET驱动器的正电源。在BST和SW之间连接一个旁路电容

器。

5

SW

Switch node. SW is the output from the high-side switch. A low forward voltage

Schottky rectifier to ground is required. The rectifier must be placed close to SW to

reduce switching spikes.

SW是高短管的输出。需要接低正向电压的肖特基二极管到地。二极管必须靠近SW，

以减少开关尖峰

6

DIM

PWM dimming input. DIM is useful in LED driver applications. Pull DIM below the

specified threshold for dimming off. Pull DIM above the specified threshold for dimming

on. If the dimming function is not needed, such as in common buck applications, then

connect DIM and EN together.

PWM调光输入。DIM在LED驱动器中使用。DIM低于阈值，灯灭；DIM高于阈

值，灯亮。如果不需要调光功能，例如在普通降压应用中，则将DIM和EN连接在

一起。

7

EN

Enable input. Pull EN below the specified threshold to shut down the HT7886. Pull EN

above the specified threshold or leave EN floating to enable the HT7886.

使能脚。将EN拉到阈值以下以关闭HT7886。将EN拉至阈值以上或悬空，以启用

HT7886。

8

GND

Ground. GND should be placed as close to the output capacitor as possible to avoid the

high-current switch paths. Connect the exposed pad to GND plane for optimal thermal

performance.

地。GND应尽可能靠近输出电容，以避免高电流开关路径。将暴露的焊盘连接到

GND平面，以获得最佳热性能

EP

GND

Provides both electrical and thermal connection from the device to the board. A matching

ground pad must be provided on the PCB and the device connected to it via solder. For

proper electrical operation, this ground pad must be connected to the system ground. 既

是地，又是散热PAD