ST7FOXK2 datasheet(220/226 Pages) STMICROELECTRONICS

220 / 226 page

Package mechanical data

ST7FOXF1, ST7FOXK1, ST7FOXK2

220/226

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 94.

20-pin plastic small outline package, 300-mil width, package outline

Table 97.

20-pin plastic small outline package, 300-mil width, mechanical data

Dim.

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

2.35

2.65

0.0925

0.1043

0.10

0.30

0.0039

0.0118

0.33

0.51

0.0130

0.0201

0.23

0.32

0.0091

0.0126

12.60

13.00

0.4961

0.5118

7.40

7.60

0.2913

0.2992

1.27

0.0500

10.00

10.65

0.3937

0.4193

0.25

0.75

0.0098

0.0295

0°

8°

0°

8°

0.40

1.27

0.0157

0.0500

Number of Pins

N20

h x 45×

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