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AS1115

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied.

Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD to GND

-0.3

7

V

All other pins to GND

-0.3

7 or

VDD + 0.3

V

DIG0:DIG7 Sink Current

500

mA

SEGA:SEGG, SEGDP Sink Current

100

mA

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 1

kV

Norm: MIL 883 E method 3015

Thermal Information

Thermal Resistance

ΘJA

88

°C/W

on PCB, QSOP-24 package

30.5

°C/W

on PCB, TQFN(4x4)-24 package

Temperature Ranges and Storage Conditions

Junction Temperature

+150

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-

020“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

1

Represents a max. floor life time of unlimited