ISO6040HDFPR datasheet(39/52 Pages) TI2

Teilenummer	ISO6040HDFPR

Bauteilbeschribung	ISO604x Low Power with High Bandwidth, Reinforced, Quad-Channel Digital Isolators

PDF	52 Pages

Scroll/Zoom	100%

Hersteller	TI2 [Texas Instruments]

Direct Link	https://www.ti.com

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39 / 52 page

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PACKAGE OUTLINE

10.63

9.97 TYP

2.55 MAX

14X 1.27

16X 0.456

0.356

8.89

(0.152) TYP

1 - 5

0.25

0.15

(1.4)

0.25

GAGE PLANE

0.962

0.708

10.5

10.1

NOTE 3

7.6

7.4

NOTE 4

4231632/A 02/2025

SOIC - 2.55 mm max height

DW0016C-C01

SMALL OUTLINE INTEGRATED CIRCUIT

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

5. Reference JEDEC registration MS-013.

0.25

C A B

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

TYPICAL

DETAIL A

SCALE 1.500

www.ti.com

ISO6041

SLLSFV3A – DECEMBER 2025 – REVISED MARCH 2026

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ISO6040HDFPR Datenblatt(PDF) 39 Page - Texas Instruments

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