LE-B-Q8WP-AM datasheet(13/22 Pages) AMSOSRAM

Datenblatt-Suchmaschine für elektronische Bauteile

LE-B-Q8WP-AM Datenblatt(PDF) 13 Page - ams-OSRAM AG

Teilenummer	LE-B-Q8WP-AM

Bauteilbeschribung	OSRAM OSTAR™ Projection Compact

PDF	22 Pages

Scroll/Zoom	100%

Hersteller	AMSOSRAM [ams-OSRAM AG]

Direct Link	https://ams-osram.com/

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13 / 22 page

LE B Q8WP Automotive

DATASHEET

13 | Version 1.2 | 2025-06-23

Recommended Solder Pad 8)

Alternative solder pad for exposed

copper MCPCB - do not use exposed

copper MCPCB for automotive

applications.

Exposed Copper MCPCB must not exceed thickness of 1mm. For superior solder joint connectivity results we recommend

soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

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