LUW H9GP

DATASHEET

DATASHEET

15 | Version 1.10 | 2023-09-29

Electrical Internal Circuit

Recommended Solder Pad 8)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB

layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat

sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package

not suitable for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the

customer is responsible to evaluate the combination of PCB board and solder paste material for his application.