PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

RC4560ID

ACTIVE

SOIC

D

8

75

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IDE4

ACTIVE

SOIC

D

8

75

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IDG4

ACTIVE

SOIC

D

8

75

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IDR

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IDRE4

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IDRG4

ACTIVE

SOIC

D

8

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

RC4560IPE4

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

RC4560IPW

ACTIVE

TSSOP

PW

8

150

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IPWE4

ACTIVE

TSSOP

PW

8

150

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IPWG4

ACTIVE

TSSOP

PW

8

150

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IPWR

ACTIVE

TSSOP

PW

8

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IPWRE4

ACTIVE

TSSOP

PW

8

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

RC4560IPWRG4

ACTIVE

TSSOP

PW

8

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

PACKAGE OPTION ADDENDUM

www.ti.com

25-Apr-2008

Addendum-Page 1