IL710 datasheet(13/24 Pages) TI

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IEC SAFETY LIMITING VALUES

100

125

150

175

200

100

150

200

CaseTemperature

−

=3.6V

CC1 VCC2

=5.5V

CC1

CC2

ISO721M-EP

www.ti.com....................................................................................................................................................................................................... SLLS882 – JUNE 2008

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the IO can allow low resistance to ground or the supply, and without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

JA = 263°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C

100

Safety input, output, or supply current

JA = 263°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C

153

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The junction-to-air thermal resistance in the Thermal

Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board

for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input

voltage times the current. The junction temperature is then the ambient temperature plus the power times the

junction-to-air thermal resistance.

THERMAL CHARACTERISTICS

(over recommended operating conditions unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-K Thermal Resistance(1)

263

°C/W

Junction-to-Air

High-K Thermal Resistance(1)

125

°C/W

Junction-to-Board Thermal

°C/W

Resistance

Junction-to-Case Thermal

°C/W

Resistance

VCC1 = VCC2 = 5.5 V, TJ = 150°C,

ISO72x

CL = 15 pF, Input a 100 Mbps 50% duty

159

cycle square wave

Device Power Dissipation

VCC1 = VCC2 = 5.5 V, TJ = 150°C,

ISO72xM CL = 15 pF, Input a 150 Mbps 50% duty

195

cycle square wave

(1)

Tested in accordance with the Low-K or High-K thermal metric definition of EIA/JESD51-3 for leaded surface mount packages.

Figure 7.

JC THERMAL DERATING CURVE per IEC 60747-5-2

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