TSC888 datasheet(5/7 Pages) STMICROELECTRONICS

Teilenummer	TSC888

Bauteilbeschribung	Low cost high-side current sense amplifier

PDF	7 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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5 / 7 page

TSC888

Package information

5/7

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

ECOPACK® packages. These packages have a lead-free second level interconnect. The

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

SOT23-5 package mechanical drawing

Table 7.

SOT23-5 package mechanical data

Ref.

Dimensions

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

0.901.45

35.457.1

0.00

0.15

0.00

5.9

0.90

1.30

35.4

51.2

0.350.50

13.719.7

0.09

0.20

3.5

7.8

2.80

3.00

110.2

118.1

2.60

3.00

102.3

118.1

1.50

1.75

59.0

68.8

0.95

37.4

1.9

74.8

0.350.55

13.721.6

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