TSH70 datasheet(25/33 Pages) STMICROELECTRONICS

Teilenummer	TSH70

Bauteilbeschribung	Rail-to-Rail, Wide-Band, Low-Power Operational Amplifiers

PDF	33 Pages

Scroll/Zoom	100%

Hersteller	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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25 / 33 page

TSH70,71,72,73,74,75

Package Mechanical Data

25/33

Package Mechanical Data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

6.1

SO-8 Package

DIM.

mm.

inch

MIN.

TYP

MAX.

MIN.

TYP.

MAX.

1.35

1.75

0.053

0.069

0.10

0.25

0.04

0.010

1.10

1.65

0.043

0.065

0.33

0.51

0.013

0.020

0.19

0.25

0.007

0.010

4.80

5.00

0.189

0.197

3.80

4.00

0.150

0.157

1.27

0.050

5.80

6.20

0.228

0.244

0.25

0.50

0.010

0.020

0.40

1.27

0.016

0.050

˚ (max.)

ddd

0.1

0.04

SO-8 MECHANICAL DATA

0016023/C

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