GS-R24FP datasheet(10/15 Pages) STMICROELECTRONICS

Teilenummer	GS-R24FP

Bauteilbeschribung	1.8 A DC-DC converter modules

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Hersteller	STMICROELECTRONICS [STMicroelectronics]

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10 / 15 page

Application information

GS-R24FP

10/15

4.9

Soldering

Soldering phase has to be execute with care : in order to avoid undesired melting

phenomenon, particular attention has to be take on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on

IPC/JEDEC J-STD-020C ,July 2004 recommendations.

Figure 3.

Soldering

Table 7.

Soldering

Profile feature

PB free assembly

Average ramp up rate ( TSMAX to TP)

3 °C / sec max

Preheat:

Temperature min ( TS MIN)

Temperature max ( TS MAX)

Time (TS MIN to TS MAX) ( tS )

150 °C

200 °C

60 – 100 sec

Time maintained above :

Temperature TL

Time tL

217 °C

40 – 70 sec

Peak temperature (TP)

240 + 0 °C

Time within 5 °C of actual peak temperature (tP)

10 – 20 sec

Ramp down rate

6 °C / sec

Time from 25 °C to peak temperature

8 minutes max

GS-R24FP Datenblatt(PDF) 10 Page - STMicroelectronics