| Datenblatt-Suchmaschine für elektronische Bauteile |
|
TS4990 Datenblatt(PDF) 24 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
TS4990 Datenblatt(HTML) 24 Page - STMicroelectronics |
|
24 / 32 page ![]() Package information TS4990 24/32 5 Package information In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. 5.1 Flip-chip package information Figure 65. Flip chip pinout (top view) Figure 66. Marking (top view) A C B 1 2 3 Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY A C B 1 2 3 Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY Vin- GND BYPASS VOUT2 VCC Vin+ VOUT1 GND STBY ■ Balls are underneath XXX YWW E XXX YWW E ■ ST logo ■ Product and assembly code: XXX A90 from Tours 90S from Shenzhen ■ Three-digit datecode: YWW ■ E symbol for lead-free only ■ The dot indicates pin A1 Symbol for lead-free package |
|
Link URL |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Link zum Datenblatt | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |